| High Precision Solder Paste And Adhesive Dispenser
The Solder Paste Jet Dispensing Machine is engineered for dense, high-precision PCB assemblies. It handles semiconductor packages, board mounting, LED back-end, Mini-LED, PC hard drives, ICs, and BGAs. Linear motor motion, laser height measurement, and vision-based compensation combine to control dot size, path, and glue volume precisely. Automated height adjustment compensates for substrate warpage, while visual feedback corrects chip placement and underfill penetration in real time. The system improves throughput, reduces operator dependence, and ensures repeatable high-quality dispensing across fine-pitch SMT boards.
| Features
Transmission Structure System
The machine uses an X/Y linear motor drive with load-type gantry to maintain stability at high speed. Reciprocating accuracy reaches 3σ ±5μm for X/Y/Z axes and dynamic accuracy 3σ ±3μm for X/Y axes. The robust motion ensures repeatable micro-dot placement for high-density ICs, Mini-LEDs, BGAs, and other fine-pitch PCB applications. Vibration is minimized, allowing high-speed production without sacrificing positional precision, which forms the foundation for reliable solder paste deposition in SMT lines.
Function Configuration
The system adapts to real PCB surfaces. It measures three PCB points, calculates the working plane, and adjusts needle height automatically. Dual cameras monitor underfill penetration during flip-chip processes, providing data feedback to the next filling cycle. Platform size, material viscosity, and process parameters can be customized. This function reduces reliance on operator skill, improves repeatability, and ensures accurate micro-dot dispensing for solder paste and adhesive, even in complex or high-density PCB layouts.
Vision Non Stop
Vision non-stop enables simultaneous inspection and dispensing. Up to 100 chips per second can be monitored. Position and height deviations are automatically corrected, and dual compensation manages both path and glue volume. Overlapping points are calculated to prevent material excess or missing dots. This function maintains high-speed operation while ensuring precise micro-dot placement for ICs and BGAs, improving yield and reducing rework in automated SMT PCB assembly.
Configuration Options And Applications
Valve type can be chosen according to material: screw valves for high-viscosity glue or solder paste, jet valves for fluid adhesives. Minimum solder paste dots reach 110μm, suitable for fine ICs and BGAs. Applications include semiconductor packages, PCB mounting, LED back-end, Mini-LED, and PC hard drives. The system allows one platform to serve multiple high-precision dispensing operations, controlling speed, path, valve, and material to achieve consistent results in complex SMT PCB production.
| High Precision Dispensing System Specifications:
| I.C.T-HD330 | High Precision SMT PCB Dispensing System |
| Max PCB Size | 50*70~250*330mm |
| Drive | Linear motor |
| X / Y repeatability precision- 3 sigma | ±5μm |
| X / Y max speed | 1500mm/sec |
| Acceleration | 1.5G |
| Picture processing-digital camera -automaton | Repeatability | ±1μm |
| Precision | MAX: 0.03sec/point |
| Alignment | S |
| Chip master | S |
| Bad mark | S |
| Repeatability precision | S |
| Non-Stop CCD | S |
| Height measure system(Laser Type) | Repeatability precision | ±1μm |
| 0.1sec/point |
| Calibration | Robot-camera | S |
| Camera-z | S |
| Camera-needle | S |
| Needle-z | S |
| Simply monitor | Dispensing area (OK/NG) | S |
| Dispensing perimeter (OK/NG) | S |
| Underfill permeation auto-monitor | S |
| Bad mark inspection | S |
| Height inspection | S |
| AOI feedback | Dispensing volume feedback | S |
| Picture processing feedback | S |
| Height measure feedback | S |
| Needle cleaning | Air blow type | S |
| Vacuum type | S |
| Material discharge | S |
| Electronic scales | Accuracy | 0.1mg / 0.01mg |
| Feedback | OPTION |
| Heat unit(pre/main/after) | OPTION |
| Compressed air | 0.4-0.6 Mpa |
| Power | AC200V,3φ,20A |
| Dimension | 1300*1100*1380mm |
| Weight | 850kg |
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.
| PCBA Coating Line Equipment List
This High Precision Dispensing System integrates with I.C.T’s coating and dispensing production line, including jet dispensers, conformal coating machines, UV/IR curing ovens, PCB conveyors, AOI inspection, and depaneling systems. The dispenser applies solder paste, adhesive, or underfill accurately, coating machines protect wider PCB areas, curing ovens finalize material reaction, AOI checks results, and depaneling equipment separates finished boards. Combined, these systems optimize throughput, reduce rework, and maintain consistent quality for SMT PCB lines.
| Product Name | Purpose in PCBA Coating Line |
Coating Machine | Applies precise protective coatings to circuit boards for dustproof, waterproof, and explosion-proof protection. |
Curing Oven | Hardens coatings with IR or UV light, ensuring durable and strong protection. |
Conveyor | Transports circuit boards smoothly through the coating line for efficient processing. |
Loader and Unloader | Provides and stores PCB for the production line, ensuring smooth input and output. |
| Conformal coating AOI | Inspects coating quality and detects defects to ensure high standards. |
| Customer Success Video
In April 2026, I.C.T completed an SMT line installation for a Portuguese automotive electronics manufacturer producing lighting and control system assemblies. Engineers handled on-site setup, line calibration, and operator training, guiding the customer team through workflow, machine operation, maintenance, and daily production practice. The customer praised the smooth installation, reliable machine performance, and practical training, noting that operators were able to operate the line efficiently and maintain consistent PCB quality.
| Service and Training Support
I.C.T provides service at the full factory level, not for individual machines alone. Before delivery, engineers evaluate PCB type, materials, output targets, workspace, and expansion plans. After shipment, installation, commissioning, operator training, maintenance guidance, and process optimization are provided. Support integrates dispensing, coating, curing, inspection, handling, and depaneling equipment into one seamless workflow. New factories are guided from layout to trial production. Existing factories receive process optimization, line balancing, and operational stability improvements for high-precision SMT production.
| What Our Customers Say
Customers consistently note I.C.T’s practical guidance. Full SMT line projects benefit from machine stability, engineer training, protective packaging, timely response, and after-sales support. Engineers explain operations clearly, reducing errors and training time. Export packaging ensures safe delivery. Technical questions during installation and production are addressed promptly, giving customers confidence in launching new SMT lines, ramping production, or upgrading existing PCB manufacturing facilities.
| Certifications and Standards
I.C.T implements structured quality management for SMT factories. The Solder Paste Jet Dispensing Machine is CE, RoHS, ISO9001 certified, with patent protection for core functions. Beyond certification, quality control includes component inspection, assembly checks, functional testing, packing verification, shipment tracking, installation records, and after-sales service. Rigorous quality management ensures consistent, repeatable solder paste and adhesive deposition, minimizes risk, and guarantees reliable operation in high-precision SMT PCB production.
| About I.C.T Company and Factory
I.C.T delivers end-to-end electronics manufacturing solutions, covering SMT, DIP, coating, dispensing, assembly, robotics, and smart factory systems. With in-house R&D, production, engineering, sales, and service teams, I.C.T supports customers from planning to steady-state operation. Beyond supplying equipment, I.C.T helps build new factories from 0 to 1 and upgrades existing lines from 1 to 10, enabling scalable, precise, and reliable SMT PCB manufacturing systems.
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